Optical profilometer D-Surface-View
D-surface-View
1. Local and global inspection from mm to nm
2. Measurement in a single acquisition
3. Nanoscale
D-Surface View is intended to help manufacturers of wafers up to 300mm in diameter reduce costs and for chipmakers to improve yields of devices manufactured with best-in-class process technology.
The equipment can be used for wafer surface quality control. It qualifies the roughness, shape, flatness and topography of the surface in a single measurement of a bare or treated insert.
Applications in optical profilometry
- Solar
- LED manufacturing
- Automotive
- Medical equipment
- Universities, research laboratories and institutes
 
																								
				 
																								
				 
																								
				More info on applications
- 2D and 3D roughness and waviness
- Shape: arc and 2D and 3D shape
- Constraint of 2D and 3D thin layers
Optical profilometry - Deflectometry
The D-Surface View is intended to help manufacturers inspect, using non-contact optical technology, large surfaces up to 300 mm in diameter for defect-free production and delivery of high-quality products.
The equipment can be used, in individual units or batches, as surface quality control or directly for in-line inspection. It qualifies surface roughness, shape, flatness and topography down to nm level in a single measurement.
Its very high resolution performance provides fast, reliable and very sensitive solutions particularly suited to large surface inspections in multiple industries.
Measurement applications:
- Texture: roughness and waviness
 You can measure 2D and 3D texture while quantifying sample roughness and waviness. The D-Surface View can distinguish between roughness and waviness components using software filters.
- Shape: arc and shape
 You can measure the 2D shape or arc of a surface and quantify the height and radius of curved structures, such as a lens.
- Constraint of thin layers
 You can easily measure 2D and 3D stresses induced when manufacturing devices with multiple process layers.
- Defect Analysis
 You can measure the topography of defects, such as the depth of a scratch.
ADVANTAGES
- Very precise measurement over a large area
- Very fast process
- Simple to insert into the production line
- No precise positioning required
 
					Spécifications
Technical characteristics
| D-Surface View 100 | D-Surface View 300 | |
|---|---|---|
| Measuring surface |  | |
| Out of plane tolerance | +/- 1 mm | +/- 3-4 mm | 
| Lateral resolution | 22 μm | 66 μm | 
| Measurement cycle time | <1 nm | 2 nm | 
| Measurement time | typ. 3-5 sec | typ. 3-5 sec | 
| Measurement time | typ. 6-25 sec | typ. 6-25 sec | 
| Accuracy of elevation map | +/- 1 nm on 10 × 10 cm2 | +/- 1 nm on 30 × 30 cm2 | 
| Cameras | 20 MPixels | 20 MPixels | 
| Outer dimensions W × H × D | 400 × 300 × 300 mm3 | 500 x 900 x 500 mm3 | 
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