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Vous êtes ici : Accueil > Produits > Optical profilometer D-Surface-View

Optical profilometer D-Surface-View

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D-surface-View

1. Local and global inspection from mm to nm
2. Measurement in a single acquisition
3. Nanoscale

D-Surface View is intended to help manufacturers of wafers up to 300mm in diameter reduce costs and for chipmakers to improve yields of devices manufactured with best-in-class process technology.
The equipment can be used for wafer surface quality control. It qualifies the roughness, shape, flatness and topography of the surface in a single measurement of a bare or treated insert.

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Applications Features Specifications
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Applications in optical profilometry

  • Solar
  • LED manufacturing
  • Automotive
  • Medical equipment
  • Universities, research laboratories and institutes
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More info on applications

- 2D and 3D roughness and waviness
- Shape: arc and 2D and 3D shape
- Constraint of 2D and 3D thin layers

Optical profilometry - Deflectometry 

The D-Surface View is intended to help manufacturers inspect, using non-contact optical technology, large surfaces up to 300 mm in diameter for defect-free production and delivery of high-quality products.
The equipment can be used, in individual units or batches, as surface quality control or directly for in-line inspection. It qualifies surface roughness, shape, flatness and topography down to nm level in a single measurement.
Its very high resolution performance provides fast, reliable and very sensitive solutions particularly suited to large surface inspections in multiple industries.

 

Measurement applications:

  • Texture: roughness and waviness
    You can measure 2D and 3D texture while quantifying sample roughness and waviness. The D-Surface View can distinguish between roughness and waviness components using software filters.
  • Shape: arc and shape
    You can measure the 2D shape or arc of a surface and quantify the height and radius of curved structures, such as a lens.
  • Constraint of thin layers
    You can easily measure 2D and 3D stresses induced when manufacturing devices with multiple process layers.
  • Defect Analysis
    You can measure the topography of defects, such as the depth of a scratch.

ADVANTAGES

- Very precise measurement over a large area
- Very fast process
- Simple to insert into the production line
- No precise positioning required

Spécifications

Technical characteristics

 

D-Surface View 100 D-Surface View 300
Measuring surface
Out of plane tolerance +/- 1 mm +/- 3-4 mm
Lateral resolution 22 μm 66 μm
Measurement cycle time <1 nm 2 nm
Measurement time typ. 3-5 sec typ. 3-5 sec
Measurement time typ. 6-25 sec typ. 6-25 sec
Accuracy of elevation map +/- 1 nm on 10 × 10 cm2 +/- 1 nm on 30 × 30 cm2
Cameras 20 MPixels 20 MPixels
Outer dimensions W × H × D 400 × 300 × 300 mm3 500 x 900 x 500 mm3

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